The X-ray analysis is performed to verify that the internal package or die construction is consistent within the lot being inspected and versus datasheet and/or with a known authentic device of the same or proximate date and lot code as available. During this process, the samples are evaluated in many attributes:

Inspect the die or multiple dies to determine that they are present, correct size, orientation and uniform planarity. The general shape, wire gauge, lead-frame, number of wire bonds, positions, structure of the package is consistent within the lot and similar to a known good (when available). The devices are free of internal damage such as die cracking, lead frame damage, unacceptable die attach voiding, broken wires or wire bonds excessive die attach voiding, die attach anomalies such as missing, partially missing, cracked, or deformed.

Determine that wire-bonds are present and intact. Correlate the datasheet, if available, with pin-outs. Note: wire-bond defects may consist of loose bond wire crushed against the die, wire resting against the die surface, wire touching the lead frame or die edge elsewhere besides the bonded area. Additionally, a pinched, kinked or deformed bond wire is considered anomalous. If wire-bonds are uniformly absent, validate if the bond wire is aluminum. Aluminum wire may not be detectable with radiographic inspection equipment.